Maitiro ekusarudza Surface Pedzisa Yeko PCB Dhizaini
Ⅱ Kuongorora uye Kuenzanisa
Zvakatumirwa: Nov 16, 2022
Categories: Blogs
Tags: pcb,pcba,pcb musangano,pcb kugadzira, pcb pamusoro kupera
Kune akawanda matipi nezve kupedzwa kwepamusoro, senge lead-isina HASL ine dambudziko rekuve nekugadzikana kunoenderana.Electrolytic Ni/Au inodhura chaizvo uye kana goridhe rakawandisa rikaiswa padhi, rinogona kutungamira kune brittle solder joints.Immersion tin ine solderability degradation mushure mekusangana neakawanda kupisa ma cycles, sekumusoro nepasi side PCBA reflow process, etc.. Misiyano yekumusoro inopera inodiwa kuti inyatsozivikanwa.Tafura iri pazasi inoratidza kuongororwa kwakakasharara kweanowanzo-kushandiswa pamusoro pekupedzisira kweakadhindwa edunhu mabhodhi.
Tafura1 Tsanangudzo muchidimbu yemaitiro ekugadzira, zvakakosha zvakanakira nezvayakaipira, uye zvakajairwa mashandisirwo eakakurumbira lead-yemahara epasi pekupedzisira ePCB.
| PCB Surface Pedzisa | Process | Ukobvu | Zvakanakira | Zvakaipa | Typical Applications |
| Kutungamira-isina HASL | Mabhodhi ePCB anonyudzwa mubhavhu rerata rakanyungudutswa ndokuzopepereswa nemapanga emhepo inopisa kuitira mapeti akapfava uye kubvisa solder yakawandisa. | 30µin(1µm) -1500µin(40µm) | Zvakanaka Solderability;Zvakawanda zvinowanikwa;Inogona kugadziriswa / kugadzirwazve;Sherufu refu refu | Uneven surfaces;Thermal shock;Kunyorova kwemvura;Solder bridge;PTHs dzakabatanidzwa. | Zvakawanda zvinoshanda;Inokodzera mapadhi makuru uye nzvimbo;Haina kukodzera HDI ine <20 mil (0.5mm) yakanaka pitch uye BGA;Hazvina kunaka kune PTH;Kwete suit kune gobvu mhangura PCB;Kazhinji, kunyorera: Mabhodhi edunhu ekuyedzwa kwemagetsi, kushambadzira nemaoko, mamwe emagetsi epamusoro-soro akadai seaerospace nemauto. |
| OSP | Kuisa musanganiswa wemakemikari kumapuranga pamusoro achigadzira organic metallic layer kudzivirira mhangura iri pachena kubva ku ngura. | 46µin (1.15µm) -52µin(1.3µm) | Mutengo wakaderera;Mapedhi akafanana uye akafuratira;Good solderability;Inogona kuva yuniti pamwe nemamwe mapedzi epamusoro;Maitiro ari nyore;Inogona kugadziriswa zvakare (mukati memusangano). | Sensitive kubata;Hupenyu hwesherufu hupfupi.Yakanyanya shoma solder kupararira;Solderability degradation ine yakakwira temp & kutenderera;Nonconductive;Zvakaoma kuongorora, ICT probe, ionic & press-fit zvinonetsa | Zvakawanda zvinoshanda;Yakanyatsokodzera SMT/fine pitches/BGA/small components;Shumira mapuranga;Hazvina kunaka kune PTHs;Haina kukodzera tekinoroji yecrimping |
| ENIG | Mushonga weKemikari unoisa mhangura yakafumurwa neNickel neGoridhe, saka inoumbwa nembiri yesimbi yesimbi. | 2µin (0.05µm)– 5µin (0.125µm) yeGoridhe pamusoro pe120µin (3µm)– 240µin (6µm) yeNickel | Excellent solderability;Mapedhi akati sandara uye akafanana;Al wire bendability;Kudzikira kwakaderera kusangana;Upenyu hurefu hwesherufu;Good corrosion resistance and durability | "Black Pad" kunetseka;Kurasikirwa kwechiratidzo chekushandiswa kwechiratidzo chekuvimbika;haigone kushanda zvakare | Yakanakira Gungano renzvimbo yakanaka uye yakaoma nzvimbo yekumisikidza (BGA, QFP…);Yakanakisa kune akawanda Soldering marudzi;Inodiwa PTH, press fit;Wire Bondable;Kurudzira PCB ine yakakwirira kuvimbika application senge aerospace, mauto, zvekurapa uye zvekupedzisira-kumagumo vatengi, nezvimwewo;Haikurudzirwe yeBata Bata Mapedhi. |
| Electrolytic Ni/Au (goridhe rakapfava) | 99.99% yakachena - 24 carat Goridhe yakaiswa pamusoro penickel layer kuburikidza ne electrolytic process pamberi pe soldermask. | 99.99% Goridhe rakachena, 24 Karat 30µin (0.8µm) -50µin (1.3µm) pamusoro pe100µin (2.5µm) -200µin (5µm) yeNickel | Nzvimbo yakaoma, yakasimba;Great conductivity;Flatness;Al wire bendability;Kudzikira kwakaderera kusangana;Hupenyu hwesherufu hurefu | Zvinodhura;Au embrittlement kana yakanyanya kukora;Layout constraints;Kuwedzera kugadzirisa / kushanda kwakanyanya;Kwete sutu ye soldering;Coating haisi yunifomu | Inonyanya kushandiswa muwaya (Al & Au) kubatanidza mune chip package senge COB (Chip paBhodhi) |
| Electrolytic Ni/Au (Goridhe rakaoma) | 98% yakachena - 23 carat Goridhe ine hardener yakawedzerwa kune yekugezesa yekugezera yakaiswa pamusoro penickel layer kuburikidza ne electrolytic process. | 98% Goridhe rakachena, 23 Karat30µin(0.8µm) -50µin(1.3µm) pamusoro pe100µin(2.5µm) -150µin(4µm) yeNickel | Excellent solderability;Mapedhi akati sandara uye akafanana;Al wire bendability;Kudzikira kwakaderera kusangana;Reworkable | Tarnish (kubata & kuchengetedza) ngura munzvimbo yakakwira sarufa;Yakaderedzwa sarudzo dzekutengesa kutsigira kupera uku;Iwindo rekushanda pfupi pakati pematanho egungano. | Inonyanya kushandiswa pakubatanidza magetsi semapendero ekubatanidza (chigunwe chegoridhe), IC carrier boards (PBGA/FCBGA/FCCSP...) , Kiyibhodhi, mabhatiri anobatika uye mamwe mapedhi ebvunzo, nezvimwe. |
| Kunyudzwa Ag | Silver layer inoiswa pamusoro pemhangura kuburikidza ne electroless plating process mushure me etch asi pamberi pe soldermask. | 5µin(0.12µm) -20µin(0.5µm) | Excellent solderability;Mapedhi akati sandara uye akafanana;Al wire bendability;Kudzikira kwakaderera kusangana;Reworkable | Tarnish (kubata & kuchengetedza) ngura munzvimbo yakakwira sarufa;Yakaderedzwa sarudzo dzekutengesa kutsigira kupera uku;Iwindo rekushanda pfupi pakati pematanho egungano. | Economical imwe nzira kune ENIG yeFine Traces uye BGA;Yakanakira kumhanyisa masaini masaini application;Yakanakira membrane switch, EMI kudzivirira, uye aluminium waya yekubatanidza;Inokodzera press fit. |
| Kunyudza Sn | Mune electroless kemikari yekugezera, chena nhete yeTin inoisa yakananga pamhangura yemabhodhi edunhu sechivharo chekudzivisa oxidation. | 25µin (0.7µm) -60µin(1.5µm) | Yakanakira tekinoroji yakakodzera tekinoroji;Zvinodhura-zvinobudirira;Planar;Yakanakisa solderability (kana nyowani) uye kuvimbika;Flatness | Solderability degradation ine yakakwira temps & kutenderera;Tini yakafumurwa pagungano rekupedzisira inogona kukanganisa;Kubata nyaya;Tin Wiskering;Haina kukodzera PTH;Iine Thiourea, inozivikanwa Carcinogen. | Kurudzira kune yakakura mari zvigadzirwa;Zvakanaka kune SMD kuiswa, BGA;Zvakanakisa zvekutsikirira fit uye backplanes;Haikurudzirwe yePTH, yekubata switch, uye kushandiswa nemasiki anopeeka |
Tafura2 Ongororo yezvakajairwa zvivakwa zvemazuva ano PCB Surface Inopedzisa pakugadzira uye kushandisa
| Kugadzirwa kweanonyanya kushandiswa pamusoro pekupedzisira | |||||||||
| Properties | ENIG | ENEPIG | Ndarama Yakapfava | Ndarama yakaoma | IAg | ISn | HASL | HASL- LF | OSP |
| Mukurumbira | High | Low | Low | Low | Pakati | Low | Low | High | Pakati |
| Process Cost | Pamusoro (1.3x) | Pamusoro (2.5x) | Pamusoro (3.5x) | Pamusoro (3.5x) | Pakati (1.1x) | Pakati (1.1x) | Pazasi (1.0x) | Pazasi (1.0x) | Pazasi (0.8x) |
| Deposit | Kunyudzwa | Kunyudzwa | Electrolytic | Electrolytic | Kunyudzwa | Kunyudzwa | Kunyudzwa | Kunyudzwa | Kunyudzwa |
| Sherufu Hupenyu | Kureba | Kureba | Kureba | Kureba | Pakati | Pakati | Kureba | Kureba | Pfupi |
| RoHS Inoenderana | Ehe | Ehe | Ehe | Ehe | Ehe | Ehe | No | Ehe | Ehe |
| Surface Co-planarity yeSMT | Excellent | Excellent | Excellent | Excellent | Excellent | Excellent | Murombo | Kugona | Excellent |
| Exposed Copper | No | No | No | Ehe | No | No | No | No | Ehe |
| Kubata | Normal | Normal | Normal | Normal | Critical | Critical | Normal | Normal | Critical |
| Process Effort | Pakati | Pakati | High | High | Pakati | Pakati | Pakati | Pakati | Low |
| Rework Capacity | No | No | No | No | Ehe | Not suggested | Ehe | Ehe | Ehe |
| Inodiwa Thermal Cycles | akawanda | akawanda | akawanda | akawanda | akawanda | 2-3 | akawanda | akawanda | 2 |
| Whisker nyaya | No | No | No | No | No | Ehe | No | No | No |
| Thermal Shock (PCB MFG) | Low | Low | Low | Low | Very Low | Very Low | High | High | Very Low |
| Low Resistance / High Speed | No | No | No | No | Ehe | No | No | No | N/A |
| Zvishandiso zvezvinonyanya kushandiswa pamusoro pekupedzisira | |||||||||
| Applications | ENIG | ENEPIG | Ndarama Yakapfava | Ndarama Yakaoma | IAg | ISn | HASL | LF-HASL | OSP |
| Rigid | Ehe | Ehe | Ehe | Ehe | Ehe | Ehe | Ehe | Ehe | Ehe |
| Flex | Restricted | Restricted | Ehe | Ehe | Ehe | Ehe | Ehe | Ehe | Ehe |
| Flex-Rigid | Ehe | Ehe | Ehe | Ehe | Ehe | Ehe | Ehe | Ehe | Not Preferred |
| Fine Pitch | Ehe | Ehe | Ehe | Ehe | Ehe | Ehe | Not Preferred | Not Preferred | Ehe |
| BGA & μBGA | Ehe | Ehe | Ehe | Ehe | Ehe | Ehe | Not Preferred | Not Preferred | Ehe |
| Multiple Solderability | Ehe | Ehe | Ehe | Ehe | Ehe | Ehe | Ehe | Ehe | Restricted |
| Flip Chip | Ehe | Ehe | Ehe | Ehe | Ehe | Ehe | No | No | Ehe |
| Dzvanya Fit | Restricted | Restricted | Restricted | Restricted | Ehe | Excellent | Ehe | Ehe | Restricted |
| Kuburikidza neburi | Ehe | Ehe | Ehe | Ehe | Ehe | No | No | No | No |
| Wire Bonding | Hongu (Al) | Hongu (Al, Au) | Hongu (Al, Au) | Hongu (Al) | Variable (Al) | No | No | No | Hongu (Al) |
| Solder Wettability | Kugona | Kugona | Kugona | Kugona | Kugona chose | Kugona | Murombo | Murombo | Kugona |
| Solder Joint Kutendeseka | Kugona | Kugona | Murombo | Murombo | Excellent | Kugona | Kugona | Kugona | Kugona |
Hupenyu hwesherufu chinhu chakakosha chaunofanira kufunga nezvacho paunenge uchiita zvirongwa zvako zvekugadzira.Sherufu Hupenyundiyo hwindo rekushanda iro rinopa kupedzisa kuve nePCB yakazara weldability.Izvo zvakakosha kuve nechokwadi chekuti maPCB ako ese akaungana mukati mehupenyu hwesherufu.Pamusoro pezvinhu uye maitiro anogadzira kupera kwepamusoro, hupenyu hwesherufu hwekupedzisa hunofurirwa zvakanyanyanePCBs kurongedza uye kuchengetedza.Kunyatso kunyorera nzira yekuchengetera yakakodzera inokurudzirwa neIPC-1601 nhungamiro inochengetedza kupera 'weldability uye kuvimbika.
Tafura3 Sherufu Hupenyu Kuenzanisa pakati Yakakurumbira Surface Inopedzisa yePCB
|
| Typical SHEL HUPENYU | Yakakurudzirwa Sherufu Hupenyu | Rework Chance |
| HASL-LF | 12 Mwedzi | 12 Mwedzi | EHE |
| OSP | 3 Mwedzi | 1 Mwedzi | EHE |
| ENIG | 12 Mwedzi | 6 Mwedzi | AIHWA* |
| ENEPIG | 6 Mwedzi | 6 Mwedzi | AIHWA* |
| Electrolytic Ni/Au | 12 Mwedzi | 12 Mwedzi | NO |
| IAg | 6 Mwedzi | 3 Mwedzi | EHE |
| ISn | 6 Mwedzi | 3 Mwedzi | EHE** |
* Ye ENIG uye ENEPIG kupedzisa kudzoreredza kutenderera kuvandudza kunyorova kwepamusoro uye hupenyu hwesherufu huripo.
** Chemical Tin rework haina kutaurwa.
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