HDI PCB kugadzira mune otomatiki PCB fekitori --- ENEPIG PCB pamusoro pekupedzisira
Zvakatumirwa:Kukadzi 03, 2023
Categories: Blogs
Tags: pcb,pcba,pcb musangano,pcb kugadzira, pcb pamusoro kupera,HDI
ENEPIG (Electroless Nickel Electroless Palladium Immersion Goridhe) haisi inowanzoshandiswa-PCB pamusoro pekupedzisira parizvino apo yave kuwedzera mukurumbira muPCB yekugadzira indasitiri.Inoshanda kune rakasiyana siyana rekushandisa semuenzaniso, akasiyana epamusoro mapakeji uye yakanyanya advanced PCB mabhodhi.ENEPIG ishanduro yakagadziridzwa yeENIG, pamwe nekuwedzera kwePalladium layer (0.1-0.5 µm/4 kusvika 20 μ'') pakati peNickel (3-6 µm/120 – 240 μ'') neGoridhe (0,02- 0,05 µm/1 kusvika 2 μ'') kuburikidza nekunyudzwa kwemakemikari maitiro muPCB fekitori.Iyo palladium inoshanda sechipingamupinyi kuchengetedza nickel layer kubva mukuora neAu, iyo inobatsira kudzivirira "black pad" kubva kuitika inova nyaya hombe yeENIG.
Kana pasina kubatanidzwa kwebhajeti, ENEPIG inoita senge iri nani sarudzo pazvizhinji zvezvimiro kunyanya zvekupedzisira-zvinoda zvinodiwa nemhando dzepasuru dzakawanda senge, kuburikidza-maburi, SMT, BGA, waya bonding, uye press fit, kana tichienzanisa neENIG.
Uyezve, Kusimba kusimba uye kuramba kunoita kuti ive hupenyu hurefu hwesherufu.Yakaonda kunyudza jasi inoita kuti zvikamu zvigadzike uye musodha zvive nyore uye zvakavimbika.Mukuwedzera, ENEPIG inopa yakavimbika Wire Bonding sarudzo.
Zvazvakanakira:
• Easy kugadzirisa
• Black Pad Yemahara
• Nzvimbo yakatsetseka
• Hupenyu hwesherufu hwakanakisa (mwedzi gumi nemaviri+)
• Kubvumira akawanda reflow cycles
• Yakanakira Plated kubudikidza Makomba
• Yakakura yeFine Pitch / BGA / Diki Zvikamu
• Yakanakira Bata Bata / Push Contact
• Yakakwirira Kuvimbika Wire Bonding (goridhe/aluminium) kupfuura ENIG
• Yakasimba Solder Kuvimbika kupfuura ENIG;Mafomu akavimbika Ni/Sn solder majoini
• Yakanyanya kuenderana neSn-Ag-Cu vatengesi
• Kuongorora kuri Nyore
Cons
• Havasi vese vanogadzira vanogona kuzvipa.
• Kunyorova kunodiwa kwenguva yakareba.
• Mutengo wepamusoro
• Kubudirira kunokonzerwa nemamiriro ekuputira
• Inogona kusavimbika pawaya yegoridhe kana ichienzaniswa neSoft Gold
Zvinonyanya kushandiswa:
High Density Assemblies, Complex kana Mixed Package Technologies, High Performance Devices, Wire Bonding application, IC carrier PCBs, nezvimwewo.
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Nguva yekutumira: Feb-02-2023
