Kunze kweakajairwa mabhodhi ePCB, PCB ShinTech zvakare inyanzvi pamhando yepamusoro-soro Rigid-flex PCBs, inorema mhangura yedunhu bhodhi, HDI mabhodhi ane ELIC, RF/Microwave edunhu mabhodhi, High kumhanya dijitari PCBs, Ceramic PCBs, Metal core PCBs, uye zvimwe zvinodiwa. kubatanidza tekinoroji yazvino, yeakasiyana maindasitiri kubva kunharembozha kusvika kukurapa, kutonga kwemaindasitiri, zvemagetsi zvevatengi, zvemauto & aerospace, mota nezvimwe.PCBShinTech ichakuchengeta iwe-kune-zvino nekucheka kumberi kufambira mberi kunowanikwa mumusika nhasi.
Kunyanya kune maPCB epamberi, PCB ShinTech inonzwisisa kudiwa kwemhando.Isu tinoisa kunaka uye kuvimbika pakutanga.Ese maPCB edu anoenderana neRoHS uye akaedzwa uye akasimbiswa ne ISO9001, TS16949 uye UL.Vamwe vane AS9100.Tiudze nezve kutsanangurwa kana zvinodiwa zveakadhindwa edunhu mabhodhi zvaunoda.Tichataura nezvemitengo inodhura zvakanyanya kwauri.
Kugona
• PCB mhando Rigid, Flexible, Rigid-Flexible
• Layer count 1-50 Layers
• Kuwanda req.> = 1 prototype, kukurumidza kutendeuka, kurongeka kudiki, kugadzirwa kwakawanda
• Zvishandiso FR-4, High TG FR-4, Rogers, Polyimide, Aluminium Clad, Metal core,Vamwe
• High Temperature, High Frequency Material
• Mhangura yakapera 0.5-18oz
• Min line trace/space 0.002/0.002" (2/2mil kana 0.05/0.05mm)
• Chero Kudhirosa Size pakati pe0.004" ne0.350"
• Solder Mask Customizable
• Silkscreen Color Customizable
• Kudzora Impedance
• Surface Finish HASL, OSP, Nickle, Immersion Gold, Imm Tin, Imm Silver, nezvimwewo.
• RoHS Inoenderana
• 100% Kuedza Kwemagetsi Inosanganisirwa
• IPC600 Kirasi II kana yepamusoro Mitemo
• ISO-9001, ISO-14000, UL, TS16949, dzimwe nguva AS9100 Certified
Nguva Yekutungamira
5-15 zuva rekushanda, kugadzirwa kwekutaura uye kutumira kwakarongwa kunowanikwa.Ndapota taura nevamiririri vedu vekutengesa kuti uwane ruzivo.
Cases
zvinhu: FR-4 TG170
Zvikamu:12
Bhodhi Ukobvu: 2 mm
Min.Track/Spacing: 3/3mil
Min Hole Size: 0.15mm
Surface Pedzisa: Kunyudza goridhe
Application: Chengetedzo Monitoring
zvinhu: TLY-5 + S1000-2M
Layer: 6
Bhodhi Ukobvu: 1.6mm
Min.Track/Spacing: 3/3mil
Min Hole Size: 0.15mm
Surface Pedzisa: Kunyudza goridhe
Application: telecommunication
zvinhu: FR-4 + FCCL
Matanho:10 akaoma + 4 anochinjika
Bhodhi Ukobvu: 1.0 mm
Min.Track/Spacing: 4/4mil
Min Hole Size: 0.20 mm
Surface Pedzisa: Kunyudza goridhe
Kushandisa: Kurapa
zvinhu: FR-4
Layer: 6
Bhodhi Ukobvu: 2 mm
Min.Track/Spacing: 10/10mil
Min Hole Size: 0.4 mm
Ukobvu hweMhangura: 10 oz
Surface Pedzisa: Kunyudza goridhe
Kushandisa: Simba
Tumira kubvunza kwako kana quote chikumbiro kwatirisales@pcbshintech.comkuti ubatanidze kune mumwe wevamiriri vedu vekutengesa vane ruzivo rweindasitiri kuti vakubatsire kuwana zano rako kumusika.
